MEMS products are rapidly becoming popular electric and automobile products.
Among MEMS automobile products, there are pressure sensors, acceleration sensors,
and gyro sensors. Also house-hold appliances and optical communication parts use MEMS chips.
As further development in the field of MEMS, chemical synthesis, analysis and life science chips are included.
Current situation in MEMS process
Just like semiconductor manufacturing process. MEMS manufacturing process has basically the same flow such as thin film; exposure, development, and etching process.
In addition to those processes, MEMS has characteristic processing steps that require back side treatment on wafers and V-grooved processing.
Fujikom's proposal for MEMS industry
We developed a new model called "PASSAGE" that fits well for the need of MEMS manufacturing processes. Visual inspection process is currently a part of the process. However, the most critical procedures try to optimize the solution of optical reaction for inspecting MEMS wafers. PASSAGE can be developed along with concept that provides the solution as process controller.
Features of PASSAGE
It utilizes results of surface and back-side of wafer automatically
Applications of PASSAGE
Lithographic, Thin film, Deep trench, CMP and Back grinding process
PASSAGE Line-up
V-grooved processing, Polishing, Non-uniformed film thickness, Defocus / Dose, Uniformity by spin coating, Pattern defect, Contamination, Back-side polishing
Process Management by PASSAGE
PASSAGE has just one standard model
PASSAGE supports 6 inch - 8inch wafers
Method of wafer handling. Open cassette, SMIF-Pod and other types of wafer loading/
